Firmware Engineer H1B salary at Intel Corporation
Intel Corporation offered a median $136,940 for Firmware Engineer roles on 21 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
Firmware Engineer offers at Intel Corporation
6% above Intel Corporation’s $128,738 median across all H1B roles in FY2025.
Where Intel Corporation files Firmware Engineer roles, FY2025
- Hillsboro, OR9 filings$120K median
- Santa Clara, CA4 filings$158K median
- Folsom, CA4 filings$130K median
- Austin, TX1 filings
- Boxborough, MA1 filings
Median and middle 50% by year
- FY2021$108K$98K–$119K
- FY2022$111K$100K–$120K
- FY2023$113K$109K–$127K
- FY2024$138K$124K–$139K
- FY2025$137K$120K–$146K
- FY2026 through Jun 30$128K$128K–$143K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2026 (through Jun 30) | 12 | $127,878 | $128K–$143K | $150K+ | $109K–$226K |
| FY2025 | 21 | $136,940 | $120K–$146K | $161K+ | $112K–$200K |
| FY2024 | 43 | $137,730 | $124K–$139K | $149K+ | $102K–$215K |
| FY2023 | 30 | $113,169 | $109K–$127K | $134K+ | $99K–$194K |
| FY2022 | 88 | $111,301 | $100K–$120K | $131K+ | $87K–$193K |
| FY2021 | 59 | $108,202 | $98K–$119K | $128K+ | $91K–$171K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Intel Corporation
- Component Design Engineer$136K median
- Software Engineer$144K median
- Process Engineer$127K median
- Graphics Hardware Engineer$136K median
- Product Engineer$136K median
- Packaging Engineer$133K median
- Engineering Manager$202K median
- Analog Engineer$139K median
- System Validation Engineer$140K median
- Data Scientist$130K median
- Research Scientist$162K median
- Graphics Software Engineer$149K median
Common questions about Firmware Engineer pay at Intel Corporation
How much does Intel Corporation pay H1B Firmware Engineer workers?
The median wage Intel Corporation offered for Firmware Engineer roles on its 21 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $136,940. The middle half of offers were between $120,400 and $146,245, and the top 10% were above $161,307, per U.S. Department of Labor records.
Has Intel Corporation's H1B pay for Firmware Engineer roles gone up?
The median offered wage went up 27%, from $108,202 in fiscal year 2021 to $136,940 in fiscal year 2025.
How does Firmware Engineer pay compare with Intel Corporation's other H1B roles?
It is 6% above Intel Corporation's median across all H1B roles in fiscal year 2025, which was $128,738.
Where does Intel Corporation hire H1B Firmware Engineer workers?
In fiscal year 2025, Intel Corporation's Firmware Engineer filings were mostly for Hillsboro, OR (9 filings, $120,400 median), Santa Clara, CA (4 filings, $158,456 median), Folsom, CA (4 filings, $130,008 median).
How many H1B applications has Intel Corporation filed for Firmware Engineer roles?
253 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2026, counting years with at least 3 filings for the title.