Component Design Engineer H1B salary at Intel Corporation
Intel Corporation offered a median $124,942 for Component Design Engineer roles on 549 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
Component Design Engineer offers at Intel Corporation
3% below Intel Corporation’s $128,738 median across all H1B roles in FY2025.
Where Intel Corporation files Component Design Engineer roles, FY2025
- Santa Clara, CA149 filings$151K median
- Hillsboro, OR125 filings$118K median
- Austin, TX118 filings$113K median
- Folsom, CA64 filings$125K median
- Boxborough, MA22 filings$117K median
Median and middle 50% by year
- FY2021$109K$93K–$128K
- FY2022$111K$95K–$127K
- FY2023$111K$96K–$130K
- FY2024$121K$106K–$137K
- FY2025$125K$108K–$151K
- FY2026 through Jun 30$136K$122K–$157K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2026 (through Jun 30) | 412 | $135,907 | $122K–$157K | $186K+ | $101K–$216K |
| FY2025 | 549 | $124,942 | $108K–$151K | $162K+ | $99K–$223K |
| FY2024 | 873 | $120,557 | $106K–$137K | $154K+ | $85K–$205K |
| FY2023 | 866 | $110,718 | $96K–$130K | $152K+ | $74K–$189K |
| FY2022 | 1,143 | $110,822 | $95K–$127K | $148K+ | $78K–$177K |
| FY2021 | 941 | $108,558 | $93K–$128K | $142K+ | $75K–$233K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Intel Corporation
- Software Engineer$144K median
- Process Engineer$127K median
- Graphics Hardware Engineer$136K median
- Product Engineer$136K median
- Packaging Engineer$133K median
- Engineering Manager$202K median
- Analog Engineer$139K median
- System Validation Engineer$140K median
- Data Scientist$130K median
- Research Scientist$162K median
- Graphics Software Engineer$149K median
- Program Manager Technical$157K median
Common questions about Component Design Engineer pay at Intel Corporation
How much does Intel Corporation pay H1B Component Design Engineer workers?
The median wage Intel Corporation offered for Component Design Engineer roles on its 549 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $124,942. The middle half of offers were between $108,160 and $151,091, and the top 10% were above $162,344, per U.S. Department of Labor records.
Has Intel Corporation's H1B pay for Component Design Engineer roles gone up?
The median offered wage went up 15%, from $108,558 in fiscal year 2021 to $124,942 in fiscal year 2025.
How does Component Design Engineer pay compare with Intel Corporation's other H1B roles?
It is 3% below Intel Corporation's median across all H1B roles in fiscal year 2025, which was $128,738.
Where does Intel Corporation hire H1B Component Design Engineer workers?
In fiscal year 2025, Intel Corporation's Component Design Engineer filings were mostly for Santa Clara, CA (149 filings, $151,221 median), Hillsboro, OR (125 filings, $117,590 median), Austin, TX (118 filings, $112,973 median).
How many H1B applications has Intel Corporation filed for Component Design Engineer roles?
4,784 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2026, counting years with at least 3 filings for the title.