Packaging Engineer H1B salary at Intel Corporation
Intel Corporation offered a median $123,490 for Packaging Engineer roles on 70 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
Packaging Engineer offers at Intel Corporation
4% below Intel Corporation’s $128,738 median across all H1B roles in FY2025.
Where Intel Corporation files Packaging Engineer roles, FY2025
- Chandler, AZ50 filings$123K median
- Hillsboro, OR18 filings$117K median
- Arlington, TX1 filings
- Santa Clara, CA1 filings
Median and middle 50% by year
- FY2021$106K$89K–$106K
- FY2022$117K$95K–$117K
- FY2023$106K$96K–$115K
- FY2024$103K$93K–$126K
- FY2025$123K$114K–$124K
- FY2026 through Jun 30$133K$117K–$146K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2026 (through Jun 30) | 45 | $133,432 | $117K–$146K | $149K+ | $105K–$177K |
| FY2025 | 70 | $123,490 | $114K–$124K | $145K+ | $99K–$155K |
| FY2024 | 115 | $103,147 | $93K–$126K | $126K+ | $86K–$180K |
| FY2023 | 168 | $105,830 | $96K–$115K | $129K+ | $78K–$135K |
| FY2022 | 155 | $117,146 | $95K–$117K | $117K+ | $78K–$148K |
| FY2021 | 88 | $106,392 | $89K–$106K | $117K+ | $75K–$168K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Intel Corporation
- Component Design Engineer$136K median
- Software Engineer$144K median
- Process Engineer$127K median
- Graphics Hardware Engineer$136K median
- Product Engineer$136K median
- Engineering Manager$202K median
- Analog Engineer$139K median
- System Validation Engineer$140K median
- Data Scientist$130K median
- Research Scientist$162K median
- Graphics Software Engineer$149K median
- Program Manager Technical$157K median
Common questions about Packaging Engineer pay at Intel Corporation
How much does Intel Corporation pay H1B Packaging Engineer workers?
The median wage Intel Corporation offered for Packaging Engineer roles on its 70 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $123,490. The middle half of offers were between $114,498 and $124,090, and the top 10% were above $144,779, per U.S. Department of Labor records.
Has Intel Corporation's H1B pay for Packaging Engineer roles gone up?
The median offered wage went up 16%, from $106,392 in fiscal year 2021 to $123,490 in fiscal year 2025.
How does Packaging Engineer pay compare with Intel Corporation's other H1B roles?
It is 4% below Intel Corporation's median across all H1B roles in fiscal year 2025, which was $128,738.
Where does Intel Corporation hire H1B Packaging Engineer workers?
In fiscal year 2025, Intel Corporation's Packaging Engineer filings were mostly for Chandler, AZ (50 filings, $123,490 median), Hillsboro, OR (18 filings, $117,083 median), Arlington, TX (1 filings).
How many H1B applications has Intel Corporation filed for Packaging Engineer roles?
641 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2026, counting years with at least 3 filings for the title.