H1B salary · Principal Engineer Firmware Engineering

Principal Engineer Firmware Engineering H1B salary at Western Digital Technologies Inc

Western Digital Technologies Inc offered a median $155,605 for Principal Engineer Firmware Engineering roles on 5 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.

Updated USCIS data through 2025DOL LCA data through

FY2025 (Oct 2024 – Sep 2025)

Principal Engineer Firmware Engineering offers at Western Digital Technologies Inc

$155,605
Median offered wage
$150K–$156K
Middle 50% of offers
$156K+
Top 10% of offers
5
Filings in FY2025

14% above Western Digital Technologies Inc’s $136,552 median across all H1B roles in FY2025.

Where Western Digital Technologies Inc files Principal Engineer Firmware Engineering roles, FY2025

  • San Jose, CA2 filings
  • Irvine, CA2 filings
  • Newark, CA1 filings

Median and middle 50% by year

  1. FY2021$148K$130K–$155K
  2. FY2022$140K$140K–$146K
  3. FY2023$134K$121K–$142K
  4. FY2024$141K$137K–$151K
  5. FY2025$156K$150K–$156K
Western Digital Technologies Inc — Principal Engineer Firmware Engineering H1B salaries by fiscal year (DOL)
Fiscal yearFilingsMedianMiddle 50%Top 10%Range
FY20255$155,605$150K–$156K$156K+$150K–$156K
FY202412$140,525$137K–$151K$160K+$113K–$161K
FY202311$134,209$121K–$142K$170K+$110K–$170K
FY20229$140,000$140K–$146K$155K+$131K–$155K
FY202120$147,500$130K–$155K$164K+$126K–$171K

These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.

Other H1B salaries at Western Digital Technologies Inc

Common questions about Principal Engineer Firmware Engineering pay at Western Digital Technologies Inc

How much does Western Digital Technologies Inc pay H1B Principal Engineer Firmware Engineering workers?

The median wage Western Digital Technologies Inc offered for Principal Engineer Firmware Engineering roles on its 5 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $155,605. The middle half of offers were between $150,470 and $155,605, and the top 10% were above $155,605, per U.S. Department of Labor records.

Has Western Digital Technologies Inc's H1B pay for Principal Engineer Firmware Engineering roles gone up?

The median offered wage went up 5%, from $147,500 in fiscal year 2021 to $155,605 in fiscal year 2025.

How does Principal Engineer Firmware Engineering pay compare with Western Digital Technologies Inc's other H1B roles?

It is 14% above Western Digital Technologies Inc's median across all H1B roles in fiscal year 2025, which was $136,552.

Where does Western Digital Technologies Inc hire H1B Principal Engineer Firmware Engineering workers?

In fiscal year 2025, Western Digital Technologies Inc's Principal Engineer Firmware Engineering filings were mostly for San Jose, CA (2 filings), Irvine, CA (2 filings), Newark, CA (1 filings).

How many H1B applications has Western Digital Technologies Inc filed for Principal Engineer Firmware Engineering roles?

57 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2025, counting years with at least 3 filings for the title.

Does Western Digital Technologies Inc sponsor H1B visas?

See Western Digital Technologies Inc’s H1B approvals by year, approval rate and salaries across every job title.

Western Digital Technologies Inc sponsorship profile →