Engineer III System Structure Design H1B salary at Samsung Electronics America Inc
Samsung Electronics America Inc offered a median $167,756 for Engineer III System Structure Design roles on 5 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
Engineer III System Structure Design offers at Samsung Electronics America Inc
4% below Samsung Electronics America Inc’s $175,000 median across all H1B roles in FY2025.
Where Samsung Electronics America Inc files Engineer III System Structure Design roles, FY2025
- Plano, TX5 filings$168K median
Median and middle 50% by year
- FY2021$144K$130K–$148K
- FY2022$138K$130K–$148K
- FY2023$147K$140K–$151K
- FY2025$168K$168K–$172K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2025 | 5 | $167,756 | $168K–$172K | $173K+ | $165K–$173K |
| FY2023 | 4 | $146,594 | $140K–$151K | $154K+ | $132K–$155K |
| FY2022 | 5 | $138,000 | $130K–$148K | $148K+ | $130K–$148K |
| FY2021 | 8 | $144,000 | $130K–$148K | $149K+ | $130K–$150K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Samsung Electronics America Inc
Common questions about Engineer III System Structure Design pay at Samsung Electronics America Inc
How much does Samsung Electronics America Inc pay H1B Engineer III System Structure Design workers?
The median wage Samsung Electronics America Inc offered for Engineer III System Structure Design roles on its 5 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $167,756. The middle half of offers were between $167,727 and $172,224, and the top 10% were above $172,646, per U.S. Department of Labor records.
Has Samsung Electronics America Inc's H1B pay for Engineer III System Structure Design roles gone up?
The median offered wage went up 16%, from $144,000 in fiscal year 2021 to $167,756 in fiscal year 2025.
How does Engineer III System Structure Design pay compare with Samsung Electronics America Inc's other H1B roles?
It is 4% below Samsung Electronics America Inc's median across all H1B roles in fiscal year 2025, which was $175,000.
Where does Samsung Electronics America Inc hire H1B Engineer III System Structure Design workers?
In fiscal year 2025, Samsung Electronics America Inc's Engineer III System Structure Design filings were mostly for Plano, TX (5 filings, $167,756 median).
How many H1B applications has Samsung Electronics America Inc filed for Engineer III System Structure Design roles?
22 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2025, counting years with at least 3 filings for the title.