Staff Packaging Engineer H1B salary at Qualcomm Technologies Inc
Qualcomm Technologies Inc offered a median $144,000 for Staff Packaging Engineer roles on 6 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
Staff Packaging Engineer offers at Qualcomm Technologies Inc
8% above Qualcomm Technologies Inc’s $133,600 median across all H1B roles in FY2025.
Where Qualcomm Technologies Inc files Staff Packaging Engineer roles, FY2025
- San Diego, CA5 filings$144K median
- Santa Clara, CA1 filings
Median and middle 50% by year
- FY2022$144K$144K–$144K
- FY2023$144K$144K–$144K
- FY2024$144K$144K–$144K
- FY2025$144K$144K–$152K
- FY2026 through Jun 30$154K$154K–$154K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2026 (through Jun 30) | 4 | $154,000 | $154K–$154K | $154K+ | $154K–$154K |
| FY2025 | 6 | $144,000 | $144K–$152K | $166K+ | $144K–$178K |
| FY2024 | 5 | $144,000 | $144K–$144K | $144K+ | $144K–$144K |
| FY2023 | 10 | $144,000 | $144K–$144K | $144K+ | $144K–$144K |
| FY2022 | 10 | $143,600 | $144K–$144K | $145K+ | $144K–$153K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Qualcomm Technologies Inc
- Senior Asics Engineer$129K median
- Senior Software Engineer$130K median
- Staff Asics Engineer$153K median
- Asics Engineer$128K median
- Software Engineer$114K median
- Staff Software Engineer$156K median
- Senior Staff Asics Engineer$176K median
- Senior Systems Test Engineer$130K median
- Systems Test Engineer$117K median
- Senior Gpu Engineer$134K median
- Senior Camera Engineer$136K median
- Senior Hardware Engineer$129K median
Common questions about Staff Packaging Engineer pay at Qualcomm Technologies Inc
How much does Qualcomm Technologies Inc pay H1B Staff Packaging Engineer workers?
The median wage Qualcomm Technologies Inc offered for Staff Packaging Engineer roles on its 6 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $144,000. The middle half of offers were between $144,000 and $151,500, and the top 10% were above $166,003, per U.S. Department of Labor records.
Has Qualcomm Technologies Inc's H1B pay for Staff Packaging Engineer roles gone up?
The median offered wage was $144,000 in both fiscal year 2022 and fiscal year 2025.
How does Staff Packaging Engineer pay compare with Qualcomm Technologies Inc's other H1B roles?
It is 8% above Qualcomm Technologies Inc's median across all H1B roles in fiscal year 2025, which was $133,600.
Where does Qualcomm Technologies Inc hire H1B Staff Packaging Engineer workers?
In fiscal year 2025, Qualcomm Technologies Inc's Staff Packaging Engineer filings were mostly for San Diego, CA (5 filings, $144,000 median) and Santa Clara, CA (1 filings).
How many H1B applications has Qualcomm Technologies Inc filed for Staff Packaging Engineer roles?
35 certified, full-time H1B Labor Condition Applications across fiscal years 2022–2026, counting years with at least 3 filings for the title.