R & D Engineer Firmware H1B salary at Broadcom Corporation
Broadcom Corporation offered a median $161,071 for R & D Engineer Firmware roles on 3 certified, full-time H1B Labor Condition Applications in FY2025 (Oct 2024 – Sep 2025), per U.S. Department of Labor records.
Updated USCIS data through 2025DOL LCA data through
R & D Engineer Firmware offers at Broadcom Corporation
7% below Broadcom Corporation’s $173,930 median across all H1B roles in FY2025.
Where Broadcom Corporation files R & D Engineer Firmware roles, FY2025
- San Jose, CA2 filings
- Austin, TX1 filings
Median and middle 50% by year
- FY2021$149K$122K–$164K
- FY2022$150K$147K–$154K
- FY2023$189K$172K–$191K
- FY2024$165K$154K–$177K
- FY2025$161K$158K–$177K
- FY2026 through Jun 30$203K$185K–$203K
| Fiscal year | Filings | Median | Middle 50% | Top 10% | Range |
|---|---|---|---|---|---|
| FY2026 (through Jun 30) | 5 | $203,462 | $185K–$203K | $204K+ | $185K–$204K |
| FY2025 | 3 | $161,071 | $158K–$177K | $186K+ | $156K–$193K |
| FY2024 | 4 | $165,229 | $154K–$177K | $187K+ | $137K–$194K |
| FY2023 | 3 | $188,700 | $172K–$191K | $192K+ | $155K–$193K |
| FY2022 | 6 | $149,854 | $147K–$154K | $163K+ | $127K–$171K |
| FY2021 | 6 | $149,357 | $122K–$164K | $169K+ | $111K–$173K |
These are wages offered on the Labor Condition Application (Form ETA-9035), annualized, not salaries actually paid. Certified full-time H1B filings for this job title only; fiscal years with fewer than 3 such filings are left out. Fiscal years run October to September. Source: U.S. Department of Labor, Office of Foreign Labor Certification disclosure data.
Other H1B salaries at Broadcom Corporation
Common questions about R & D Engineer Firmware pay at Broadcom Corporation
How much does Broadcom Corporation pay H1B R & D Engineer Firmware workers?
The median wage Broadcom Corporation offered for R & D Engineer Firmware roles on its 3 certified, full-time H1B Labor Condition Applications in fiscal year 2025 was $161,071. The middle half of offers were between $158,390 and $176,937, and the top 10% were above $186,456, per U.S. Department of Labor records.
Has Broadcom Corporation's H1B pay for R & D Engineer Firmware roles gone up?
The median offered wage went up 8%, from $149,357 in fiscal year 2021 to $161,071 in fiscal year 2025.
How does R & D Engineer Firmware pay compare with Broadcom Corporation's other H1B roles?
It is 7% below Broadcom Corporation's median across all H1B roles in fiscal year 2025, which was $173,930.
Where does Broadcom Corporation hire H1B R & D Engineer Firmware workers?
In fiscal year 2025, Broadcom Corporation's R & D Engineer Firmware filings were mostly for San Jose, CA (2 filings) and Austin, TX (1 filings).
How many H1B applications has Broadcom Corporation filed for R & D Engineer Firmware roles?
27 certified, full-time H1B Labor Condition Applications across fiscal years 2021–2026, counting years with at least 3 filings for the title.